Near-infrared absorption composition, cured film, near-infrared absorption filter, solid-state imaging device, and infrared sensor

ABSTRACT

To provide a near-infrared absorption composition capable of forming a film having excellent visible transparency and near-infrared shieldability, a cured film, a near-infrared absorption filter, a solid-state imaging device, and an infrared sensor. A near-infrared absorption composition includes a compound represented Formula (1) and a resin, the compound has a maximum absorption wavelength in a wavelength range of 750 to 830 nm in a film in a case where the film is formed using the near-infrared absorption composition, and a value obtained by dividing an absorbance at a wavelength of 555 nm by an absorbance at the maximum absorption wavelength is 0.10 or less.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of PCT International Application No.PCT/JP2016/055364 filed on Feb. 24, 2016, which claims priority under 35U.S.C §119(a) to Japanese Patent Application No. 2015-037818 filed onFeb. 27, 2015. Each of the above application(s) is hereby expresslyincorporated by reference, in its entirety, into the present application

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a near-infrared absorption composition,a cured film, a near-infrared absorption filter, a solid-state imagingdevice, and an infrared sensor.

2. Description of the Related Art

In a video camera, a digital still camera, a cellular phone with acamera function, or the like, a charge coupled device (CCD) or acomplementary metal oxide semiconductor (CMOS) which is a solid-stateimaging device for a color image is used. These solid-state imagingdevices use a silicon photodiode having sensitivity to a near-infraredray in a light receiving section thereof. Therefore, visibilitycorrection is required and a near-infrared absorption filter is used inmany cases.

JP2009-263614A discloses that a pyrrolopyrrole compound having aspecific structure is used as a near-infrared absorption substance.

In CHEMISTRY A EUROPEAN JOURNAL, vol. 15, 4857-4864 (2009), using apyrrolopyrrole compound as a fluorescent dye is described.

SUMMARY OF THE INVENTION

The pyrrolopyrrole compound described in JP2009-263614A is a compoundwhich has absorption in a near-infrared region and is excellent ininvisibility. However, in recent years, a near-infrared absorptionsubstance has been required to be further improved in visibletransparency.

CHEMISTRY A EUROPEAN JOURNAL, vol. 15, 4857-4864 (2009) describes theinvention relating to a fluorescent dye, and has no description orsuggestion relating to visible transparency and near-infraredshieldability. Moreover, description or suggestion relating to spectralcharacteristics in a film is not disclosed at all.

Various compounds which form association in an aqueous solution has beenknown. However, in the related art, it has been thought that even in acase where a compound forms association in an aqueous solution, when afilm is formed using a composition containing a resin, the associationof the compound is inhibited by the resin. Therefore, in general, acomposition containing the compound disclosed in CHEMISTRY A EUROPEANJOURNAL, vol. 15, 4857-4864 (2009) and a resin is not used to form afilm.

Accordingly, an object of the invention is to provide a near-infraredabsorption composition capable of forming a film having excellentvisible transparency and near-infrared shieldability. In addition, theinvention is to provide a cured film, a near-infrared absorption filter,a solid-state imaging device, and an infrared sensor.

The inventors have conducted an intensive examination and, as a result,have found that the object can be achieved by increasing shieldabilityin a specific wavelength region, and completed the invention. Theinvention provides the followings.

<1> A near-infrared absorption composition comprising: a compoundrepresented by Formula (1); and a resin, in which the compound has amaximum absorption wavelength in a wavelength range of 750 to 830 nm ina film in a case where the film is formed using the near-infraredabsorption composition, and a value obtained by dividing an absorbanceat a wavelength of 555 nm by an absorbance at the maximum absorptionwavelength is 0.10 or less,

in the formula, R^(1a) and R^(1b) each independently represent an alkylgroup, an aryl group, or a heteroaryl group, Ar¹ and Ar² eachindependently represent a heteroaryl group, R² and R³ each independentlyrepresent a hydrogen atom or a substituent, and R⁴ to R⁷ eachindependently represent a substituent.

<2> The near-infrared absorption composition according to <1>, in whichin Formula (1), R⁴ to R⁷ each independently represent an aryl group or aheteroaryl group.

<3> The near-infrared absorption composition according to <1> or <2>, inwhich in Formula (1), Ar¹ and Ar² each independently represent any oneof Formulae (A) to (C):

in Formula (A), —X_(A)— represents —O—, —N(R³⁰)—, or —C(R³¹)(R³²)—, R¹¹to R¹⁴ each independently represent a hydrogen atom or a substituent,R³⁰ represents a hydrogen atom, an alkyl group, or an aryl group, R³¹and R³² each independently represent an alkyl group or an aryl group,and * represents a bonding position to Formula (1),

in Formula (B), R¹⁵ to R¹⁷ each independently represent a hydrogen atomor a substituent, any two of R¹⁵ to R¹⁷ may be bonded to each other toform a ring, and * represents a bonding position to Formula (1), and

in Formula (C), —X_(C)— represents —O— or —N(R³³)—, R¹⁸ to R²³ eachindependently represent a hydrogen atom or a substituent, R³³ representsa hydrogen atom, an alkyl group, or an aryl group, and * represents abonding position to Formula (1).

<4> The near-infrared absorption composition according to any one of <1>to <3>, in which in Formula (1), R² and R³ each independently representan electron-withdrawing group.

<5> The near-infrared absorption composition according to any one of <1>to <3>, in which in Formula (1), R² and R³ are cyano groups.

<6> The near-infrared absorption composition according to any one of <1>to <5>, in which in Formula (1), R^(1a) and R^(1b) each independentlyrepresent a branched alkyl group, or an aryl group or a heteroaryl grouphaving, as a substituent, a group having a branched alkyl structure.

<7> The near-infrared absorption composition according to any one of <1>to <6>, further comprising: an organic solvent.

<8> The near-infrared absorption composition according to any one of <1>to <7>, in which the resin is at least one selected from a (meth)acrylicresin, a polyester resin, and an epoxy resin.

<9> The near-infrared absorption composition according to any one of <1>to <8>, in which the resin includes a resin having a polymerizablegroup.

<10> The near-infrared absorption composition according to any one of<1> to <9>, further comprising: a curable compound.

<11> A cured film which is prepared using the near-infrared absorptioncomposition according to any one of <1> to <10>.

<12> A near-infrared absorption filter comprising: the cured filmaccording to <11>.

<13> A solid-state imaging device comprising: the cured film accordingto <11>.

<14> An infrared sensor comprising: the cured film according to <11>.

According to the invention, there is provided a near-infrared absorptioncomposition capable of forming a film having excellent visibletransparency and near-infrared shieldability. In addition, it ispossible to provide a cured film, a near-infrared absorption filter, asolid-state imaging device, and an infrared sensor.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view schematically illustrating aconfiguration of an infrared sensor according to an embodiment of theinvention.

FIG. 2 is a block diagram illustrating functions of an image pickupdevice to which an infrared sensor according to the invention isapplied.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, the contents of the invention will be described in detail.

In this specification, the expression “to” is used to mean thatnumerical values before and after the expression are included as a lowerlimit value and an upper limit value.

In the description of a group (atomic group) in this specification, adenotation without substitution and unsubstitution includes a group(atomic group) with a substituent, together with a group (atomic group)without a substituent. For example, an “alkyl group” includes not onlyan alkyl group (unsubstituted alkyl group) without a substituent butalso an alkyl group (substituted alkyl group) with a substituent.

In this specification, “(meth)acrylate” represents acrylate andmethacrylate, “(meth)acryl” represents acryl and methacryl, and“(meth)acryloyl” represents acryloyl and methacryloyl.

In this specification, a polymerizable compound refers to a compoundhaving a polymerizable functional group, and may be a monomer or apolymer. A polymerizable functional group refers to a group involved ina polymerization reaction.

A weight average molecular weight and a number average molecular weightof a compound used in the invention can be measured by gel permeationchromatography (GPC), and are defined as values in terms of polystyrenemeasured by GPC.

In this specification, a near-infrared ray refers to light with amaximum absorption wavelength region of 700 to 2,500 nm (electromagneticwave).

In this specification, a total solid content refers to a total mass ofcomponents except for a solvent from the entire content of acomposition. In the invention, a solid content is a solid content at 25°C.

<Near-Infrared Absorption Composition>

A near-infrared absorption composition according to the invention is anear-infrared absorption composition containing: a compound(hereinafter, also referred to as Compound (1)) represented by Formula(1) to be described later; and a resin. Compound (1) has a maximumabsorption wavelength in a wavelength range of 750 to 830 nm in a filmin a case where the film is formed using the near-infrared absorptioncomposition, and a value obtained by dividing an absorbance at awavelength of 555 nm by an absorbance at the maximum absorptionwavelength is 0.10 or less.

Compound (1) has a maximum absorption wavelength in a wavelength rangeof 750 to 830 nm in a film, and preferably has a maximum absorptionwavelength in a wavelength range of 770 to 810 nm. In addition,regarding Compound (1), a value obtained by dividing an absorbance at awavelength of 555 nm by an absorbance at the maximum absorptionwavelength is 0.10 or less, and preferably 0.05 or less in a film.Regarding the film, a content of an organic solvent is preferably 5 mass% or less, and more preferably 1 mass % or less.

In Compound (1), a half-width of the maximum absorption wavelength inthe film is preferably not greater than 130 nm, more preferably notgreater than 100 nm, and even more preferably not greater than 60 nm.The lower limit thereof is, for example, preferably not less than 20 nm.

Compound (1) is a compound having excellent transmitting properties in avisible region (for example, wavelength 400 to 700 nm) and absorption ina near-infrared region. The reason why such characteristics are obtainedis not clear, but presumed to be due to a balance between acceptorproperties by a heteroaryl group of Ar¹ and Ar² and donor properties ofa pyrrole ring by a boron substituent having R⁴ to R⁷. In addition,using a compound which has a maximum absorption wavelength in awavelength range of 750 to 830 nm in a film, and in which a valueobtained by dividing an absorbance at a wavelength of 555 nm by anabsorbance at the maximum absorption wavelength is 0.10 or less, it ispossible to increase shieldability in a wavelength region of 750 to 830nm which is a boundary with a visible region without damagingtransmitting properties in the visible region. As a result, precisewaveform control is possible with no occurrence of absorption in thevisible region, and thus it is possible to provide a near-infraredabsorption composition capable of forming a film having excellentvisible transparency and near-infrared shieldability.

Hereinafter, the invention will be described in detail.

<<Compound Represented by Formula (1)>>

In the formula, R^(1a) and R^(1b) each independently represent an alkylgroup, an aryl group, or a heteroaryl group.

Ar¹ and Ar² each independently represent a heteroaryl group.

R² and R³ each independently represent a hydrogen atom or a substituent.

R⁴ to R⁷ each independently represent a substituent.

In Formula (1), R^(1a) and R^(1b) each independently represent an alkylgroup, an aryl group, or a heteroaryl group.

R^(1a) and R^(1b) may be the same or different groups. R^(1a) and R^(1b)are preferably the same groups.

R^(1a) and R^(1b) each are independently preferably an aryl group or aheteroaryl group, and more preferably an aryl group. In thisspecification, an aryl group means an aromatic hydrocarbon group, and aheteroaryl group means an aromatic heterocyclic group.

The number of carbon atoms of the alkyl group is preferably 1 to 40,more preferably 1 to 30, and even more preferably 1 to 25. The alkylgroup may be linear, branched, or cyclic. The alkyl group is preferablylinear or branched, and particularly preferably branched.

As the aryl group, an aryl group having 6 to 20 carbon atoms ispreferable, and an aryl group having 6 to 12 carbon atoms is morepreferable. A phenyl group or a naphthyl group is particularlypreferable.

The heteroaryl group may be monocyclic or polycyclic. The number ofhetero atoms constituting the heteroaryl group is preferably 1 to 3. Asthe hetero atom constituting the heteroaryl group, a nitrogen atom, anoxygen atom, or a sulfur atom is preferable. The number of carbon atomsconstituting the heteroaryl group is preferably 3 to 30, more preferably3 to 18, and even more preferably 3 to 12.

The aryl group and the heteroaryl group described above may have asubstituent or may be unsubstituted. The aryl group and the heteroarylgroup preferably have a substituent.

Examples of the substituent include a hydrocarbon group which mayinclude an oxygen atom, an amino group, an acylamino group, asulfonylamino group, a sulfamoyl group, a carbamoyl group, an alkylthiogroup, an alkylsulfonyl group, a sulfinyl group, an ureido group, aphosphoric acid amido group, a mercapto group, a sulfo group, a carboxylgroup, a nitro group, a hydroxamic group, a sulfino group, a hydrazinogroup, an imino group, a silyl group, a hydroxy group, a halogen atom,and a cyano group.

Examples of the halogen atom include a fluorine atom, a chlorine atom, abromine atom, and an iodine atom.

Examples of the hydrocarbon group include an alkyl group, an alkenylgroup, and an aryl group.

The number of carbon atoms of the alkyl group is preferably 1 to 40. Thelower limit thereof is more preferably not less than 3, even morepreferably not less than 5, still more preferably not less than 8, andparticularly preferably not less than 10. The upper limit thereof ismore preferably not greater than 35, and even more preferably notgreater than 30. The alkyl group may be linear, branched, or cyclic. Thealkyl group is preferably linear or branched, and particularlypreferably branched. The number of carbon atoms of a branched alkylgroup is preferably 3 to 40. The lower limit thereof is, for example,more preferably not less than 5, even more preferably not less than 8,and still more preferably not less than 10. The upper limit thereof ismore preferably not greater than 35, and even more preferably notgreater than 30. The number of branches of a branched alkyl group is,for example, preferably 2 to 10, and more preferably 2 to 8.Satisfactory solvent solubility is obtained in a case where the numberof branches is within the above-described range.

The number of carbon atoms of the alkenyl group is preferably 2 to 40.The lower limit thereof is, for example, more preferably not less than3, even more preferably not less than 5, still more preferably not lessthan 8, and particularly preferably not less than 10. The upper limitthereof is more preferably not greater than 35, and even more preferablynot greater than 30. The alkenyl group may be linear, branched, orcyclic. The alkenyl group is preferably linear or branched, andparticularly preferably branched. The number of carbon atoms of abranched alkenyl group is preferably 3 to 40. The lower limit thereofis, for example, more preferably not less than 5, even more preferablynot less than 8, and still more preferably not less than 10. The upperlimit thereof is more preferably not greater than 35, and even morepreferably not greater than 30. The number of branches of a branchedalkenyl group is preferably 2 to 10, and more preferably 2 to 8.Satisfactory solvent solubility is obtained in a case where the numberof branches is within the above-described range.

The number of carbon atoms of the aryl group is preferably 6 to 30, morepreferably 6 to 20, and even more preferably 6 to 12.

Examples of the hydrocarbon group including an oxygen atom include agroup represented by -L-R^(x1).

L represents —O—, —CO—, —COO—, —OCO—, —(OR^(x2))_(m)—, or—(R^(x2)O)_(m)—. R^(x1) represents an alkyl group, an alkenyl group, oran aryl group. R^(x2) represents an alkylene group or an arylene group.m represents an integer of 2 or more. m R^(x2)'s may be the same as ordifferent from each other.

L is preferably —O—, —(OR^(x2))_(m)—, or —(R^(x2)O)_(m)—, and morepreferably —O—.

The alkyl group, the alkenyl group, or the aryl group represented byR^(x1) is synonymous with those described above, and preferable rangesthereof are also similar to those in the above description. R^(x1) ispreferably an alkyl group or an alkenyl group, and more preferably analkyl group.

The number of carbon atoms of the alkylene group represented by R^(x2)is preferably 1 to 20, more preferably 1 to 10, and even more preferably1 to 5. The alkylene group may be linear, branched, or cyclic. Thealkylene group is preferably linear or branched. The number of carbonatoms of the arylene group represented by R^(x2) is preferably 6 to 20,and more preferably 6 to 12. R^(x2) is preferably an alkylene group.

m represents an integer of 2 or more, and is preferably 2 to 20, andmore preferably 2 to 10.

The substituent that the aryl group and the heteroaryl group may have ispreferably a group having a branched alkyl structure. According to thisaspect, solvent solubility is further improved. In addition, thesubstituent is preferably a hydrocarbon group which may include anoxygen atom, and more preferably a hydrocarbon group which includes anoxygen atom. The hydrocarbon group including an oxygen atom ispreferably a group represented by —O—R^(x1). R^(x1) is preferably analkyl group or an alkenyl group, more preferably an alkyl group, andparticularly preferably a branched alkyl group. That is, the substituentis more preferably an alkoxy group, and particularly preferably abranched alkoxy group. In a case where the substituent is an alkoxygroup, it is possible to obtain a near-infrared absorption substancehaving excellent heat resistance and light resistance. In addition, in acase where the substituent is a branched alkoxy group, Compound (1)obtains satisfactory solvent solubility.

The number of carbon atoms of the alkoxy group is preferably 1 to 40.The lower limit thereof, for example, more preferably not less than 3,even more preferably not less than 5, still more preferably not lessthan 8, and particularly preferably not less than 10. The upper limitthereof is more preferably not greater than 35, and even more preferablynot greater than 30. The alkoxy group may be linear, branched, orcyclic. The alkoxy group is preferably linear or branched, andparticularly preferably branched. The number of carbon atoms of abranched alkoxy group is preferably 3 to 40. The lower limit thereof is,for example, more preferably not less than 5, even more preferably notless than 8, and still more preferably not less than 10. The upper limitthereof is more preferably not greater than 35, and even more preferablynot greater than 30. The number of branches of a branched alkoxy groupis preferably 2 to 10, and more preferably 2 to 8.

In Formula (1), R² and R³ each independently represent a hydrogen atomor a substituent. R² and R³ may be the same or different groups. R² andR³ are preferably the same groups.

Examples of the substituent include a hydrocarbon group which mayinclude an oxygen atom, an amino group, an acylamino group, asulfonylamino group, a sulfamoyl group, a carbamoyl group, an alkylthiogroup, an alkylsulfonyl group, a sulfinyl group, an ureido group, aphosphoric acid amido group, a mercapto group, a sulfo group, a carboxylgroup, a nitro group, a hydroxamic group, a sulfino group, a hydrazinogroup, an imino group, a silyl group, a hydroxy group, a halogen atom,and a cyano group. Examples of the hydrocarbon group which may includean oxygen atom are as described above.

R² and R³ are preferably electron-withdrawing groups.

A substituent of which Hammett sigma para value (op value) is positiveacts as an electron-withdrawing group.

According to the invention, a substituent of which Hammett σp value is0.2 or greater can be exemplified as an electron-withdrawing group. Theσp value is preferably not less than 0.25, more preferably not less than0.3, and even more preferably not less than 0.35. The upper limitthereof is not particularly limited, and is preferably 0.80.

Specific examples of the electron-withdrawing group include a cyanogroup (op value=0.66), a carboxyl group (—COOH: σp value=0.45), analkoxycarbonyl group (for example, —COOMe: σp value=−0.45), anaryloxycarbonyl group (for example, —COOPh: σp value=0.44), a carbamoylgroup (—CONH₂: σp value=0.36), an alkylcarbonyl group (for example,—COMe: σp value=0.50), an arylcarbonyl group (for example, —COPh: σpvalue=0.43), an alkylsulfonyl group (for example, —SO₂Me: σpvalue=0.72), and an arylsulfonyl group (for example, —SO₂Ph: σpvalue=0.68). A cyano group is particularly preferable. Here, Merepresents a methyl group, and Ph represents a phenyl group.

Regarding the Hammette σp value, paragraphs 0024 and 0025 ofJP2009-263614A can be referred to, and the contents thereof areincorporated into this specification.

In Formula (1), Ar¹ and Ar² each independently represent a heteroarylgroup. Ar¹ and Ar² may be the same or different groups. Ar¹ and Ar² arepreferably the same groups.

The heteroaryl group is preferably monocyclic or fused, more preferablymonocyclic or fused with a fused number of 2 to 8, and even morepreferably monocyclic or fused with a fused number of 2 to 4. The numberof hetero atoms constituting the heteroaryl group is preferably 1 to 3.As the hetero atom constituting the heteroaryl group, a nitrogen atom,an oxygen atom, or a sulfur atom is preferable. The number of carbonatoms constituting the heteroaryl group is preferably 3 to 30, morepreferably 3 to 18, even more preferably 3 to 12, and still morepreferably 3 to 10. The heteroaryl group is preferably a 5-membered ringor a 6-membered ring.

The heteroaryl group is more preferably a group represented by any oneof the following Formulae (A) to (C).

In a case where at least one, or preferably both of Ar¹ and Ar² are agroup represented by any one of the following Formulae (A) to (C), anabsorption waveform selectively having absorption in a wavelength rangeof 750 to 830 nm is obtained. Furthermore, in a case where at least one,or preferably both of Ar¹ and Ar² are a group represented by any one ofthe following Formulae (A) to (C), and R⁴ to R⁷ are aryl groups orheteroaryl groups, a sharp absorption waveform is obtained in a film.

In Formula (A), —X_(A)— represents —O—, —N(R³)—, or —C(R³¹)(R³²)—. R¹¹to R¹⁴ each independently represent a hydrogen atom or a substituent.R³⁰ represents a hydrogen atom, an alkyl group, or an aryl group. R³¹and R³² each independently represent an alkyl group or an aryl group. *represents a bonding position to Formula (1). Any two of R¹¹ to R¹⁴ arenot bonded to each other to form a ring.

In Formula (A), —X_(A)— represents —O—, —N(R³⁰)—, or —C(R³¹)(R³²)—.

R³⁰ represents a hydrogen atom, an alkyl group, or an aryl group. R³¹and R³² each independently represent an alkyl group or an aryl group.

The number of carbon atoms of the alkyl group is preferably 1 to 20,more preferably 1 to 15, and even more preferably 1 to 8. The alkylgroup may be linear, branched, or cyclic. The alkyl group is preferablylinear or branched. The alkyl group may have a substituent or may beunsubstituted. Examples of the substituent include a halogen atom, ahydroxyl group, a carboxyl group, a sulfo group, and an amino group.

The number of carbon atoms of the aryl group is preferably 6 to 30, morepreferably 6 to 20, and even more preferably 6 to 12. These groups mayhave a substituent or may be unsubstituted. Examples of the substituentare as described above. The alkyl group may be provided as asubstituent.

R¹¹ to R¹⁴ each independently represent a hydrogen atom or asubstituent. Examples of the substituent include a hydrocarbon groupwhich may include an oxygen atom, an amino group, an acylamino group, asulfonylamino group, a sulfamoyl group, a carbamoyl group, an alkylthiogroup, an alkylsulfonyl group, a sulfinyl group, an ureido group, aphosphoric acid amido group, a mercapto group, a sulfo group, a carboxylgroup, a nitro group, a hydroxamic group, a sulfino group, a hydrazinogroup, an imino group, a silyl group, a hydroxy group, a halogen atom,and a cyano group. Examples of the hydrocarbon group which may includean oxygen atom are as described above.

Each of R¹¹ to R¹⁴ is preferably a hydrogen atom, a hydrocarbon groupwhich may include an oxygen atom, or a halogen atom, and more preferablya hydrogen atom, an alkyl group, an aryl group, an alkoxy group, or ahalogen atom.

In Formula (A), any two of R¹¹ to R¹⁴ are not bonded to each other toform a ring. That is, the group represented by Formula (A) does notinclude the following structure. In a case where the compoundrepresented by Formula (1) has the following substituent, the maximumabsorption wavelength tends to increase and be out of a desired range.

In Formula (B), R¹⁵ to R¹⁷ each independently represent a substituent,and any two of R¹⁵ to R¹⁷ may be bonded to each other to form a ring. *represents a bonding position to Formula (1).

R¹⁵ to R¹⁷ each independently represent a hydrogen atom or asubstituent. Examples of the substituent include the substituentsdescribed in the description of R¹¹ to R¹⁴. Each of R¹⁵ to R¹⁷ ispreferably a hydrogen atom, a hydrocarbon group which may include anoxygen atom, or a halogen atom, and more preferably a hydrogen atom, analkyl group, an aryl group, an alkoxy group, or a halogen atom.

In Formula (B), any two of R¹⁵ to R¹⁷ may be bonded to each other toform a ring, and preferably form a ring. In a case where any two of R¹⁵to R¹⁷ form a ring, the maximum absorption wavelength of the compound iseasily adjusted within a desired range. Examples of the ring include a5-membered ring and a 6-membered ring, and a 6-membered ring ispreferable. That is, Formula (B) preferably has any one of a structurerepresented by the following (B1) and a structure represented by thefollowing (B2). In the formulae, R^(B1) to R^(B8) each independentlyrepresent a hydrogen atom or a substituent. Examples of the substituentinclude the substituents described in the description of R¹¹ to R¹⁴.

In Formula (C), —X_(C)— represents —O— or —N(R³³)—. R¹⁸ to R²³ eachindependently represent a hydrogen atom or a substituent. R³³ representsa hydrogen atom, an alkyl group, or an aryl group. * represents abonding position to Formula (1).

R¹⁸ to R²³ each independently represent a hydrogen atom or asubstituent. Examples of the substituent include the substituentsdescribed in the description of R¹¹ to R¹⁴. Each of R¹⁸ to R²³ ispreferably a hydrogen atom, a hydrocarbon group which may include anoxygen atom, or a halogen atom, and more preferably a hydrogen atom, analkyl group, an aryl group, an alkoxy group, or a halogen atom.

R³³ represents a hydrogen atom, an alkyl group, or an aryl group. Thealkyl group and the aryl group are synonymous with the those describedin the description of R³⁰, and preferable ranges thereof are alsosimilar to those in the above description.

In Formula (1), R⁴ to R⁷ each independently represent a substituent. Thesubstituent is preferably a halogen atom, an alkyl group, an alkoxygroup, an aryl group, or a heteroaryl group, more preferably a halogenatom, an aryl group, or a heteroaryl group, and even more preferably anaryl group or a heteroaryl group.

In Formula (1), R⁴ and R⁶ may be the same or different groups, and R⁵and R⁷ may be the same or different groups. It is preferable that R⁴ andR⁶ are the same groups, and R⁵ and R⁷ are the same groups.

The halogen atom is preferably a fluorine atom, a chlorine atom, abromine atom, or an iodine atom, and particularly preferably a fluorineatom.

The number of carbon atoms of the alkyl group is preferably 1 to 40. Thelower limit thereof is, for example, more preferably not less than 3.The upper limit thereof is, for example, more preferably not greaterthan 30, and even more preferably not greater than 25. The alkyl groupmay be linear, branched, or cyclic. The alkyl group is preferably linearor branched.

The number of carbon atoms of the alkoxy group is preferably 1 to 40.The lower limit thereof is, for example, more preferably not less than3. The upper limit thereof is, for example, more preferably not greaterthan 30, and even more preferably not greater than 25. The alkoxy groupmay be linear, branched, or cyclic. The alkoxy group is preferablylinear or branched.

The number of carbon atoms of the aryl group is preferably 6 to 20, andmore preferably 6 to 12. The aryl group is preferably a phenyl group ora naphthyl group. The aryl group may have a substituent or may beunsubstituted. Examples of the substituent include an alkyl group, analkoxy group, and a halogen atom. Details of these are as describedabove.

The heteroaryl group may be monocyclic or polycyclic. The number ofhetero atoms constituting the heteroaryl group is preferably 1 to 3. Asthe hetero atom constituting the heteroaryl group, a nitrogen atom, anoxygen atom, or a sulfur atom is preferable. The number of carbon atomsconstituting the heteroaryl group is preferably 3 to 30, more preferably3 to 18, even more preferably 3 to 12, and particularly preferably 3 to5. The heteroaryl group is preferably a 5-membered ring or a 6-memberedring. The heteroaryl group may have a substituent or may beunsubstituted. Examples of the substituent include an alkyl group, analkoxy group, and a halogen atom. Details of these are as describedabove.

The compound represented by Formula (1) is preferably a compound inwhich R⁴ to R⁷ each independently represent an aryl group or aheteroaryl group, and Ar¹ and Ar² each independently represent a grouprepresented by any one of the above-described Formulae (A) to (C), andmore preferably a compound in which R⁴ to R⁷ each independentlyrepresent an aryl group or a heteroaryl group, and Ar¹ and Ar² eachindependently represent a group represented by the above-describedFormula (A).

The compound represented by Formula (1) is preferably a compoundrepresented by the following Formula (1A).

In the formula, R¹⁰⁰ and R¹⁰¹ each independently represent asubstituent.

-   -   Ar¹ and Ar² each independently represent a heteroaryl group.    -   R² and R³ each independently represent a hydrogen atom or a        substituent.    -   R⁴ to R⁷ each independently represent a substituent.

Ar1, Ar2, and R² to R⁷ of Formula (1A) are synonymous with Ar¹, Ar², andR² to R⁷ of Formula (1), and preferable ranges thereof are also similarto those in the above description.

Examples of the substituents represented by R¹⁰⁰ and R¹⁰¹ of Formula(1A) include a hydrocarbon group which may include an oxygen atom, anamino group, an acylamino group, a sulfonylamino group, a sulfamoylgroup, a carbamoyl group, an alkylthio group, an alkylsulfonyl group, asulfinyl group, an ureido group, a phosphoric acid amido group, amercapto group, a sulfo group, a carboxyl group, a nitro group, ahydroxamic group, a sulfino group, a hydrazino group, an imino group, asilyl group, a hydroxy group, a halogen atom, and a cyano group. Thesubstituent is preferably a hydrocarbon group which may include anoxygen atom, and more preferably a hydrocarbon group which includes anoxygen atom.

Examples of the hydrocarbon group including an oxygen atom include agroup represented by -L-R^(x1). The group represented by -L-R^(x1) issynonymous with the group represented by -L-R^(x1) described in thedescription of the substituent that R^(1a) and R^(1b) of Formula (1A)may have, and preferable ranges thereof are also similar to those in theabove description.

Examples of the compound represented by Formula (1) include thefollowing compounds.

In the near-infrared absorption composition according to the invention,the content of the compound represented by Formula (1) can be adjustedif necessary. For example, the content is preferably 0.01 to 50 mass %in the total solid content of the composition. The lower limit thereofis more preferably not less than 0.1 mass %, and even more preferablynot less than 0.5 mass %. The upper limit thereof is more preferably notgreater than 30 mass %, and even more preferably not greater than 15mass %. By adjusting the content within this range, a satisfactorynear-infrared absorption capability can be given. In a case where thenear-infrared absorption composition according to the invention includestwo or more types of compounds represented by Formula (1), a totalcontent thereof is preferably within the above-described range.

<Resin>

The near-infrared absorption composition according to the inventionincludes a resin. Examples of the resin include a (meth)acrylic resin,an epoxy resin, an ene-thiol resin, a polycarbonate resin, a polyetherresin, a polyarylate resin, a polysulfone resin, a polyethersulfoneresin, a polyparaphenylene resin, a polyarylene ether phosphine oxideresin, a polyimide resin, a polyamide-imide resin, a polyolefin resin, acyclic olefin resin, and a polyester resin. These resins may be usedsingly, or as a mixture of two or more types thereof.

Among these, an acrylic resin, a polyester resin, and an epoxy resin arepreferable, and an acrylic resin is more preferable from the viewpointof solubility of Compound (1) to the resin and visible transparency.

The weight average molecular weight (Mw) of the resin is preferably notless than 2,000, and more preferably 2,000 to 2,000,000. The upper limitthereof is even more preferably not greater than 1,000,000, and stillmore preferably not greater than 500,000. The lower limit thereof iseven more preferably not less than 3,000, and still more preferably notless than 5,000.

In a case of an epoxy resin, the weight average molecular weight (Mw) ofthe epoxy resin is preferably not less than 100, and more preferably 200to 2,000,000. The upper limit thereof is even more preferably notgreater than 1,000,000, and still more preferably not greater than500,000. The lower limit thereof is even more preferably not less than100, and still more preferably not less than 200.

Examples of the (meth)acrylic resin include a polymer including aconstituent unit derived from at least one of a (meth)acrylic acid andits esters. Specifically, a polymer obtained by polymerizing at leastone selected from a (meth)acrylic acid, (meth)acrylic acid esters,(meth)acrylamide, and (meth)acrylonitrile is exemplified.

Examples of the polyester resin include polymers obtained by thereaction between polyols (for example, ethylene glycol, propyleneglycol, glycerin, and trimethylolpropane) and polybasic acids (forexample, aromatic dicarboxylic acids such as a terephthalic acid, anisophthalic acid, and a naphthalene dicarboxylic acid, aromaticdicarboxylic acids in which a hydrogen atom of an aromatic nucleus ofthe above aromatic dicarboxylic acids is substituted with a methylgroup, an ethyl group, a phenyl group, or the like, aliphaticdicarboxylic acids having 2 to 20 carbon atoms such as an adipic acid, asebacic acid, and a dodecanedicarboxylic acid, and alicyclicdicarboxylic acids such as a cyclohexane dicarboxylic acid), andpolymers (for example, polycaprolactone) obtained by ring-openingpolymerization of circular ester compounds such as a caprolactonemonomer.

Examples of the epoxy resin include bisphenol A epoxy resins, bisphenolF epoxy resins, phenol novolac epoxy resins, cresol novolac epoxyresins, and aliphatic epoxy resins. Commercially available productsthereof are as follows.

Examples of the bisphenol A epoxy resins include JER 827, JER 828, JER834, JER 1001, JER 1002, JER 1003, JER 1055, JER 1007, JER 1009, JER1010 (all manufactured by Mitsubishi Chemical Corporation), EPICLON 860,EPICLON 1050, EPICLON 1051, and EPICLON 1055 (all manufactured by DICCorporation).

Examples of the bisphenol F epoxy resins include JER 806, JER 807, JER4004, JER 4005, JER 4007, JER 4010 (all manufactured by MitsubishiChemical Corporation), EPICLON 830, EPICLON 835 (all manufactured by DICCorporation), LCE-21, and RE-602S (all manufactured by Nippon KayakuCo., Ltd.).

Examples of the phenol novolac epoxy resins include JER 152, JER 154,JER 157S70, JER 157S65 (all manufactured by Mitsubishi ChemicalCorporation), EPICLON N-740, EPICLON N-770, and EPICLON N-775 (allmanufactured by DIC Corporation).

Examples of the cresol novolac epoxy resins include EPICLON N-660,EPICLON N-665, EPICLON N-670, EPICLON N-673, EPICLON N-680, EPICLONN-690, EPICLON N-695 (all manufactured by DIC Corporation), andEOCN-1020 (all manufactured by Nippon Kayaku Co., Ltd.).

Examples of the aliphatic epoxy resins include ADEKA RESIN EP-4080S,ADEKA RESIN EP-4085S, ADEKA RESIN EP-4088S (all manufactured by ADEKACorporation), CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2083, CELLOXIDE2085, EHPE3150, EPOLEAD PB 3600, EPOLEAD PB 4700 (all manufactured byDAICEL Corporation), DENACOL EX-212L, EX-214L, EX-216L, EX-321L, andEX-850L (all manufactured by Nagase ChemteX Corporation).

ADEKA RESIN EP-4000S, ADEKA RESIN EP-4003S, ADEKA RESIN EP-4010S, ADEKARESIN EP-4011S (all manufactured by ADEKA Corporation), NC-2000,NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (all manufactured by ADEKACorporation), and JER 1031S (manufactured by Mitsubishi ChemicalCorporation) are also included.

The resin may have a group (hereinafter, also referred to as an acidgroup) promoting alkali solubility. Examples of the acid group include acarboxyl group, a phosphate group, a sulfonate group, and a phenolichydroxyl group. These acid groups may be used singly, or two or moretypes thereof may be used. The resin having a group promoting alkalisolubility is also referred to as an alkali-soluble resin.

As the alkali-soluble resin, a polymer having a carboxyl group on a sidechain is preferable, and examples thereof include alkali-solublephenolic resins such as a methacrylic acid copolymer, an acrylic acidcopolymer, an itaconic acid copolymer, a crotonic acid copolymer, amaleic acid copolymer, a partially esterified maleic acid copolymer, anda novolac resin, acid cellulose derivatives having a carboxyl group on aside chain, and polymers having a hydroxyl group with an acid anhydrideadded thereto. Particularly, copolymers of a (meth)acrylic acid withother monomers copolymerizable with the (meth)acrylic acid arepreferable as the alkali-soluble resin. Examples of other monomerscopolymerizable with a (meth)acrylic acid include alkyl (meth)acrylate,aryl (meth)acrylate, and a vinyl compound. Examples of the alkyl(meth)acrylate and the aryl (meth)acrylate include methyl(meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl(meth)acrylate, isobutyl (meth)acrylate, pentyl (meth)acrylate, hexyl(meth)acrylate, octyl (meth)acrylate, phenyl (meth)acrylate, benzyl(meth)acrylate, tolyl (meth)acrylate, naphthyl (meth)acrylate, andcyclohexyl (meth)acrylate. Examples of the vinyl compound includestyrene, α-methylstyrene, vinyl toluene, glycidyl methacrylate,acrylonitrile, vinyl acetate, N-vinylpyrrolidone, tetrahydrofurfurylmethacrylate, polystyrene macromonomer, and polymethyl methacrylatemacromonomer. In addition, as other monomers, N-phenylmaleimide,N-cyclohexylmaleimide, and the like which are N-substituted maleimidemonomers described in JP1998-300922A (JP-H10-300922A) can be used. Theseother monomers copolymerizable with a (meth)acrylic acid may be usedsingly, or two or more types thereof may be used.

As the alkali-soluble resin, benzyl (meth)acrylate/(meth)acrylic acidcopolymers, benzyl (meth)acrylate/(meth)acrylic acid/2-hydroxyethyl(meth)acrylate copolymers, and multicomponent copolymers consisting ofbenzyl (meth)acrylate/(meth)acrylic acid/other monomers can bepreferably used. In addition, 2-hydroxypropyl (meth)acrylate/polystyrenemacromonomer/benzyl methacrylate/methacrylic acid copolymers,2-hydroxy-3-phenoxypropyl acrylate/polymethyl methacrylatemacromonomer/benzyl methacrylate/methacrylic acid copolymers,2-hydroxyethyl methacrylate/polystyrene macromonomer/methylmethacrylate/methacrylic acid copolymers, 2-hydroxyethylmethacrylate/polystyrene macromonomer/benzyl methacrylate/methacrylicacid copolymers, and the like which are obtained by copolymerizing a2-hydroxyethyl (meth)acrylate and described in JP1995-140654A(JP-H7-140654A) can also be preferably used.

The alkali-soluble resin preferably includes a polymer (a) obtained bypolymerizing a monomer component including at least one of a compoundrepresented by the following Formula (ED1) or a compound represented bythe following Formula (ED2) (hereinafter, these compounds may bereferred to as “ether dimers”).

In Formula (ED1), R¹ and R² each independently represent a hydrocarbongroup having 1 to 25 carbon atoms which may have a hydrogen atom or asubstituent.

In Formula (ED2), R represents a hydrogen atom or an organic grouphaving 1 to 30 carbon atoms. Regarding specific examples of Formula(ED2), the description in JP2010-168539A can be referred to.

In Formula (ED1), the hydrocarbon group having 1 to 25 carbon atomswhich may have a substituent, represented by R¹ and R², is notparticularly limited, and examples thereof include linear or branchedalkyl groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl,isobutyl, tert-butyl, tert-amyl, stearyl, lauryl, and 2-ethylhexyl; arylgroups such as phenyl; alicyclic groups such as cyclohexyl,tert-butylcyclohexyl, dicyclopentadienyl, tricyclodecanyl, isobornyl,adamantyl, and 2-methyl-2-adamantyl; alkyl groups substituted withalkoxy such as 1-methoxyethyl and 1-ethoxyethyl; and alkyl groupssubstituted with an aryl group such as benzyl. Among these,particularly, a substituent of a primary or secondary carbon that hardlyseparates due to an acid or heat, such as methyl, ethyl, cyclohexyl, orbenzyl is preferable in view of heat resistance.

Regarding specific examples of the ether dimers, for example, paragraph0317 of JP2013-29760A can be referred to, and the contents thereof areincorporated into this specification. The ether dimers may be usedsingly, or two or more types thereof may be used.

The alkali-soluble resin may include a constituent unit derived from acompound represented by the following Formula (X).

In Formula (X), R₁ represents a hydrogen atom or a methyl group. R₂represents an alkylene group having 2 to 10 carbon atoms. R₃ representsa hydrogen atom or an alkyl group having 1 to 20 carbon atoms which mayinclude a benzene ring. n represents an integer of 1 to 15.

In the above Formula (X), the number of carbon atoms of the alkylenegroup of R₂ is preferably 2 or 3. The number of carbon atoms of thealkyl group of R₃ is 1 to 20, and is preferably 1 to 10. The alkyl groupof R₃ may include a benzene ring. Examples of the alkyl grouprepresented by R₃ which includes a benzene ring include a benzyl groupand a 2-phenyl(iso)propyl group.

Regarding the alkali-soluble resin, the description in paragraphs 0558to 0571 of JP2012-208494A ([0685] to [0700] of US2012/0235099Acorresponding thereto) and the description in paragraphs 0076 to 0099 ofJP2012-198408A can be referred to, and the contents thereof areincorporated into this specification.

The acid value of the alkali-soluble resin is preferably 30 to 200mgKOH/g. The lower limit thereof is more preferably not less than 50mgKOH/g, and even more preferably not less than 70 mgKOH/g. The upperlimit thereof is more preferably not greater than 150 mgKOH/g, and evenmore preferably not greater than 120 mgKOH/g or less.

In addition, the resin may have a polymerizable group. In a case wherethe resin has a polymerizable group, it is possible to form a hard filmwithout using a curable compound to be described later.

Examples of the polymerizable group include a (meth)allyl group and a(meth)acryloyl group. Examples of the resin containing a polymerizablegroup include DIANAL NR series (manufactured by Mitsubishi Rayon Co.,Ltd.), Photomer 6173 (COOH-containing polyurethane acrylic oligomer,manufactured by Diamond Shamrock Co., Ltd.), VISCOAT R-264, KS RESIST106 (all manufactured by OSAKA ORGANIC CHEMICAL INDUSTRY LTD.), CYCLOMERP series (for example, ACA230AA), PLACCEL CF 200 series (allmanufactured by Daicel Chemical Industries, Ltd.), Ebecryl 3800(manufactured by Daicel-UCB Co., Ltd.), and ACRYCURE RD-F8 (manufacturedby NIPPON SHOKUBAI CO., LTD.). The above-described epoxy resins are alsobe included.

In the near-infrared absorption composition according to the invention,the content of the resin is preferably 1 to 80 mass % with respect tothe total solid content of the near-infrared absorption composition. Thelower limit thereof is more preferably not less than 5 mass %, and evenmore preferably not less than 7 mass %. The upper limit thereof is morepreferably not greater than 50 mass %, and even more preferably notgreater than 30 mass %.

<<Curable Compound>>

The near-infrared absorption composition according to the invention maycontain a curable compound. As the curable compound, a compound(hereinafter, may be referred to as “polymerizable compound) having apolymerizable group is preferable.

Examples of the polymerizable compound include a compound having a grouphaving an ethylenically unsaturated bond, a cyclic ether (epoxy oroxetane) group, a methylol group, or the like, and a compound includinga group having an ethylenically unsaturated bond is preferable. Examplesof the group having an ethylenically unsaturated bond include a vinylgroup, a (meth)allyl group, and a (meth)acryloyl group.

The polymerizable compound may be monofunctional or polyfunctional, andis preferably polyfunctional. In a case where a polyfunctional compoundis included, near-infrared shieldability and heat resistance can befurther improved. The number of functional groups is not particularlylimited, but the compound is preferably bi- to octa-functional, and morepreferably tri- to hexa-functional.

The polymerizable compound may have any chemical form such as a monomer,a prepolymer, an oligomer or a mixture thereof, or a polymer thereof.The polymerizable compound is preferably a monomer.

The polymerizable compound is preferably a tri- to pentadeca-functional(meth)acrylate compound, and more preferably a tri- to hexa-functional(meth)acrylate compound.

The molecular weight of the polymerizable compound is preferably lessthan 2,000, more preferably 100 to less than 2,000, and even morepreferably 200 to less than 2,000.

The curable compound is preferably a compound including a group havingan ethylenically unsaturated bond.

Regarding examples of the compound including a group having anethylenically unsaturated bond, the description in paragraphs 0033 and0034 of JP2013-253224A can be referred to, and the contents thereof areincorporated into this specification. Specific preferable examplesthereof include ethyleneoxy-modified pentaerythritol tetraacrylate (as acommercially available product, NK ester ATM-35E; manufactured byShin-Nakamura Chemical Co., Ltd.), dipentaerythritol triacrylate (as acommercially available product, KAYARAD D-330; manufactured by NipponKayaku Co., Ltd.), dipentaerythritol tetraacrylate (as a commerciallyavailable product, KAYARAD D-320; manufactured by Nippon Kayaku Co.,Ltd.), dipentaerythritol penta(meth)acrylate (as a commerciallyavailable product, KAYARAD D-310; manufactured by Nippon Kayaku Co.,Ltd.), dipentaerythritol hexa(meth)acrylate (as commercially availableproducts, KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd.,A-DPH-12E; manufactured by Shin-Nakamura Chemical Co., Ltd.), andcompounds including a structure in which these (meth)acryloyl groups arebonded via an ethylene glycol or a propylene glycol residue. Inaddition, oligomer types thereof can also be used.

In addition, the description of the polymerizable compound in paragraphs0034 to 0038 of JP2013-253224A can be referred to, and the contentsthereof are incorporated into this specification.

In addition, polymerizable monomers described in paragraph 0477 ofJP2012-208494A ([0585] of US2012/0235099A corresponding thereto) arealso included as specific examples, and the contents thereof areincorporated into this specification.

As the compound including a group having an ethylenically unsaturatedbond, diglycerine ethyleneoxide (EO)-modified (meth)acrylate (as acommercially available product, M-460; manufactured by Toagosei Co.,Ltd.) is preferable. Pentaerythritol tetraacrylate (manufactured byShin-Nakamura Chemical Co., Ltd., A-TMMT) and 1,6-hexanediol diacrylate(manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA) are alsopreferable. Oligomer types thereof can also be used. Examples thereofinclude RP-1040 (manufactured by Nippon Kayaku Co., Ltd.).

The compound including a group having an ethylenically unsaturated bondmay further have an acid group such as a carboxyl group, a sulfonategroup, and a phosphate group.

Examples of the compound having an acid group include an ester of analiphatic polyhydroxy compound with an unsaturated carboxylic acid. Apolyfunctional monomer allowed to have an acid group by reacting anon-aromatic carboxylic acid anhydride with an unreacted hydroxyl groupof an aliphatic polyhydroxy compound is preferable. Particularlypreferably, an aliphatic polyhydroxy compound is at least one ofpentaerythritol or dipentaerythritol. Examples of commercially availableproducts thereof include M-305, M-510, and M-520 of ARONIX series, aspolybasic acid-modified acrylic oligomers manufactured by Toagosei Co.,Ltd.

The acid value of the compound having an acid group is preferably 0.1 to40 mgKOH/g. The lower limit thereof is more preferably not less than 5mgKOH/g. The upper limit thereof is more preferably not greater than 30mgKOH/g.

As an aspect of the curable compound, a compound having a caprolactonestructure is also preferable.

Regarding the compound having a caprolactone structure, the descriptionin paragraphs 0042 to 0045 of JP2013-253224A can be referred to, and thecontents thereof are incorporated into this specification.

Examples of commercially available products thereof include SR-494 whichis a tetrafunctional acrylate having four ethyleneoxy chainsmanufactured by Sartomer Inc., DPCA-60 which is a hexafunctionalacrylate having six pentyleneoxy chains manufactured by Nippon KayakuCo., Ltd., and TPA-330 which is a trifunctional acrylate having threeisobutyleneoxy chains.

In a case where the near-infrared absorption composition according tothe invention contains a curable compound, the content of the curablecompound is preferably 1 to 90 mass % with respect to the total solidcontent of the near-infrared absorption composition. The lower limitthereof is more preferably not less than 15 mass %, and even morepreferably not less than 40 mass %. The upper limit thereof ispreferably not greater than 80 mass %, and even more preferably notgreater than 75 mass %.

The curable compound may be used singly, or two or more types thereofmay be used. In a case where two or more types are used, the totalamount thereof is preferably within the above-described range.

<<Photopolymerization Initiator>>

The near-infrared absorption composition according to the invention maycontain a photopolymerization initiator.

The content of the photopolymerization initiator is preferably 0.01 to30 mass % with respect to the total solid content of the near-infraredabsorption composition. The lower limit thereof is more preferably notless than 0.1 mass %, and even more preferably not less than 0.5 mass %.The upper limit thereof is more preferably not greater than 20 mass %,and even more preferably not greater than 15 mass %.

The photopolymerization initiator may be used singly, or two or moretypes thereof may be used. In a case where two or more types are used,the total amount thereof is preferably within the above-described range.

The photopolymerization initiator is not particularly limited, as longas it has a capability of initiating polymerization of the curablecompound by light. The photopolymerization initiator can beappropriately selected according to the purpose. A photopolymerizationinitiator having photosensitivity to light rays from an ultravioletregion to a visible region is preferable.

The photopolymerization initiator is preferably a compound having atleast an aromatic group, and examples thereof include an acylphosphinecompound, an acetophenone-based compound, an α-aminoketone compound, abenzophenone-based compound, a benzoin ether-based compound, a ketalderivative compound, a thioxanthone compound, an oxime compound, ahexaarylbiimidazole compound, a trihalomethyl compound, an azo compound,an organic peroxide, an onium salt compound such as a diazoniumcompound, an iodonium compound, a sulfonium compound, an aziniumcompound, and a metallocene compound, an organic boron salt compound, adisulfone compound, and a thiol compound.

Regarding the photopolymerization initiator, the description inparagraphs 0217 to 0228 of JP2013-253224A can be referred to, and thecontents thereof are incorporated into this specification.

As the oxime compound, IRGACURE-OXE01, IRGACURE-OXE02 (all manufacturedby BASF SE), TR-PBG-304 (manufactured by Changzhou Tronly New ElectronicMaterials CO., LTD.), ADEKA ARKLS NCI-831, and ADEKA ARKLS NCI-930 (allmanufactured by ADEKA Corporation), and the like which are commerciallyavailable products can be used.

As the acetophenone-based compound, IRGACURE-907, IRGACURE-369, andIRGACURE-379 (all manufactured by BASF SE) which are commerciallyavailable products can be used. As the acylphosphine compound,IRGACURE-819 and DAROCUR-TPO (all manufactured by BASF SE) which arecommercially available products can be used.

According to the invention, an oxime compound having a fluorine atom canalso be used as the photopolymerization initiator. Specific examples ofthe oxime compound having a fluorine atom include compounds described inJP2010-262028A, Compounds 24, and 36 to 40 described in JP2014-500852A,and Compound (C-3) described in JP2013-164471A. The contents thereof areincorporated into this specification.

<<Solvent>>

The near-infrared absorption composition according to the invention maycontain a solvent. The solvent is not particularly limited, and can beappropriately selected according to the purpose, as long as respectivecomponents of the near-infrared absorption composition according to theinvention can be evenly dissolved or dispersed. For example, water or anorganic solvent can be used, and an organic solvent is preferable.

Preferable examples of the organic solvent include alcohols (forexample, methanol), ketones, esters, aromatic hydrocarbons, halogenatedhydrocarbons, dimethylformamide, dimethylacetamide, dimethylsulfoxide,and sulfolane. These may be used singly, or two or more types thereofmay be used in combination. In a case where two or more types ofsolvents are used in combination, a mixed solution formed of two or moreselected from methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethylcellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether,butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone,ethyl carbitol acetate, butyl carbitol acetate, ethylene glycolmonobutyl ether acetate, propylene glycol monomethyl ether, andpropylene glycol monomethyl ether acetate is preferable.

Specific examples of the alcohols, the aromatic hydrocarbons, and thehalogenated hydrocarbons include those described in paragraph 0136 ofJP2012-194534A, and the contents thereof are incorporated into thisspecification. In addition, specific examples of the esters, theketones, and the ethers include those described in paragraph 0497 ofJP2012-208494A ([0609] of US2012/0235099A corresponding thereto), andfurther include n-amyl acetate, ethyl propionate, dimethyl phthalate,ethyl benzoate, methyl sulfate, acetone, methyl isobutyl ketone, diethylether, and ethylene glycol monobutyl ether acetate.

The amount of the organic solvent in the near-infrared absorptioncomposition according to the invention is preferably an amount providedsuch that a solid content of the compound represented by Formula (1) is10 to 90 mass %. The lower limit thereof is more preferably not lessthan 20 mass %. The upper limit thereof is more preferably not greaterthan 80 mass %.

<<Surfactant>>

The near-infrared absorption composition according to the invention maycontain a surfactant. The surfactant may be used singly, or two or moretypes thereof may be used in combination. The content of the surfactantis preferably 0.0001 to 5 mass % with respect to the total solid contentof the near-infrared absorption composition according to the invention.The lower limit thereof is more preferably not less than 0.005 mass %,and even more preferably not less than 0.01 mass %. The upper limitthereof is more preferably not greater than 2 mass %, and even morepreferably not greater than 1 mass %.

As the surfactant, various surfactants such as a fluorine-basedsurfactant, a nonionic surfactant, a cation-based surfactant, ananion-based surfactant, and a silicone-based surfactant can be used. Thenear-infrared absorption composition according to the inventionpreferably contains at least one of a fluorine-based surfactant or asilicone-based surfactant. Due to the surfactant, the interface tensionbetween a coating surface and a coating liquid is lowered, andwettability to the coating surface is thus improved. Therefore, liquidcharacteristics (particularly, fluidity) of the composition is improved,and uniformity of a coating thickness and liquid saving properties arefurther improved. As a result, even in a case where a film having asmall thickness of approximately several micrometers is formed with asmall amount of a liquid, a film having a uniform thickness with littlethickness unevenness can be formed.

The fluorine content of the fluorine-based surfactant is preferably 3 to40 mass %. The lower limit thereof is more preferably not less than 5mass %, and even more preferably not less than 7 mass %. The upper limitthereof is more preferably not greater than 30 mass %, and even morepreferably not greater than 25 mass %. A fluorine-based surfactanthaving a fluorine content within the above-described range is effectivein view of uniformity of a thickness of a coating film and liquid savingproperties, and satisfactory solubility is obtained. Specific examplesof the fluorine-based surfactant include surfactants described inparagraphs 0060 to 0064 of JP2014-41318A (paragraphs 0060 to 0064 ofWO2014/17669A corresponding thereto), and the contents thereof areincorporated into this specification. Examples of commercially availableproducts of the fluorine-based surfactant include MEGAFAC F-171, MEGAFACF-172, MEGAFAC F-173, MEGAFAC F-176, MEGAFAC F-177, MEGAFAC F-141,MEGAFAC F-142, MEGAFAC F-143, MEGAFAC F-144, MEGAFAC R30, MEGAFAC F-437,MEGAFAC F-475, MEGAFAC F-479, MEGAFAC F-482, MEGAFAC F-554, MEGAFACF-780, (all manufactured by DIC Corporation), FLUORAD FC430, FLUORADFC431, FLUORAD FC171 (all manufactured by Sumitomo 3M Limited.), SURFLONS-382, SURFLON SC-101, SURFLON SC-103, SURFLON SC-104, SURFLON SC-105,SURFLON SC-1068, SURFLON SC-381, SURFLON SC-383, SURFLON S-393, andSURFLON KH-40 (all manufactured by Asahi Glass Co., Ltd.).

The following compound is also exemplified as the fluorine-basedsurfactant which is used in the invention.

The weight average molecular weight of the above compound is, forexample, 14,000.

Specific examples of the nonionic surfactant include nonionicsurfactants described in paragraph 0553 of JP2012-208494A ([0679] ofUS2012/0235099A corresponding thereto), and the contents thereof areincorporated into this specification.

Specific examples of the cationic surfactant include cationicsurfactants described in paragraph 0554 of JP2012-208494A ([0680] ofUS2012/0235099A corresponding thereto), and the contents thereof areincorporated into this specification.

Specific examples of the anionic surfactant include W004, W005, and W017(manufactured by Yusho Co., Ltd.).

Examples of the silicone-based surfactant include silicone-basedsurfactants described in paragraph 0556 of JP2012-208494A ([0682] ofUS2012/0235099A corresponding thereto), and the contents thereof areincorporated into this specification.

<<Polymerization Inhibitor>>

The near-infrared absorption composition according to the invention maycontain a small amount of a polymerization inhibitor in order to preventunnecessary reaction of the curable compound during the manufacturing orpreservation.

Examples of the polymerization inhibitor include hydroquinone,p-methoxyphenol, di-t-butyl-p-cresol, pyrogallol, t-butylcatechol,benzoquinone, 4,4′-thiobis(3-methyl-6-t-butylphenol),2,2′-methylenebis(4-methyl-6-t-butylphenol), andN-nitrosophenylhydroxyamine cerous salt, and p-methoxyphenol ispreferable.

In a case where the near-infrared absorption composition according tothe invention contains a polymerization inhibitor, the content of thepolymerization inhibitor is preferably 0.01 to 5 mass % with respect tothe total solid content of the near-infrared absorption compositionaccording to the invention.

<<Ultraviolet Absorbing Agent>>

The near-infrared absorption composition according to the invention maycontain an ultraviolet absorbing agent.

The ultraviolet absorbing agent is a compound in which the lightabsorption coefficient per gram at a wavelength of 365 nm is greaterthan 100 and the light absorption coefficient per gram at a wavelengthof 400 nm or greater is 10 or less. The light absorption coefficient isa value which is measured at a concentration of 0.01 g/L using an ethylacetate solvent with an ultraviolet visible light spectrophotometer(manufactured by Varian, Cary-5 spectrophotometer).

As the ultraviolet absorbing agent, compounds in paragraphs 0137 to 0142of JP2012-068418A (paragraphs 0251 to 0254 of US2012/0068292Acorresponding thereto) can be used, and the contents thereof can beemployed and are incorporated into this specification. Examples ofcommercially available products thereof include UV503 (DAITO CHEMICALCO., LTD.).

The near-infrared absorption composition according to the invention mayinclude or may not include an ultraviolet absorbing agent. However, in acase where the near-infrared absorption composition according to theinvention includes an ultraviolet absorbing agent, the content of theultraviolet absorbing agent is preferably 0.01 to 10 mass %, and morepreferably 0.01 to 5 mass % with respect to the total solid content ofthe composition.

According to the invention, the ultraviolet absorbing agent may be usedsingly, or two or more types thereof may be used in combination.

<<Other Near-Infrared Absorption Substances>>

The near-infrared absorption composition according to the invention mayfurther include a near-infrared absorption substance (hereinafter, alsoreferred to as other near-infrared absorption substances) having amaximum absorption wavelength in a near-infrared region different fromthe maximum absorption wavelength of the compound represented by Formula(1). According to this aspect, it is possible to obtain a near-infraredabsorption filter which can absorb light in a near-infrared region witha wider wavelength region than in a case of light absorbed only by thecompound represented by Formula (1).

Examples of other near-infrared absorption substances include a coppercompound, a cyanine-based dye compound, a phthalocyanine-based compound,an iminium-based compound, a thiol complex-based compound, a transitionmetal oxide-based compound, a squarylium-based dye compound, anaphthalocyanine-based dye compound, a quaterrylene-based dye compound,a dithiolmetal complex-based dye compound, and a croconium compound.

As the phthalocyanine-based compound, the naphthalocyanine-basedcompound, the iminium-based compound, the cyanine-based dye compound,the squarylium-based dye compound, and the croconium-based compound,compounds described in paragraphs 0010 to 0081 of JP2010-111750A may beused, and the contents thereof are incorporated into this specification.Regarding the cyanine-based dye compound, for example, “Functional Dye,written by Okawara Shin, Matsuoka Ken, Kitao Teijirou, and HirashimaKousuke, published by Kodansha Scientific Ltd.” can be referred to, andthe contents thereof are incorporated into this specification.

As the copper compound, copper compounds described in paragraphs 0013 to0056 of JP2014-41318A and paragraphs 0012 to 0030 of JP2014-32380A maybe used, and the contents thereof are incorporated into thisspecification.

Compounds disclosed in paragraphs 0004 to 0016 of JP1995-164729A(JP-H07-164729A), compounds disclosed in paragraphs 0027 to 0062 ofJP2002-146254A, and near-infrared absorption particles which aredisclosed in paragraphs 0034 to 0067 of JP2011-164583A, consist ofcrystallites of an oxide including at least one of Cu or P, and have anumber average aggregate particle diameter of 5 to 200 nm may be used,and the contents thereof are incorporated into this specification.

In addition, as commercially available products thereof, “IRA842”manufactured by Exciton, “FD-25” manufactured by Yamada Kagaku Co.,Ltd., and the like can be used.

<<Other Components>>

Examples of other components which can be used in combination in thenear-infrared absorption composition according to the invention includea sensitizing agent, a crosslinking agent, a curing accelerator, afiller, a thermal curing accelerator, a thermal polymerizationinhibitor, and a plasticizer, and an adhesion promoter to a substratesurface and other auxiliary agents (for example, conductive particles, afiller, an antifoaming agent, a flame retardant, a leveling agent, apeeling promoter, an antioxidant, a fragrance material, a surfacetension adjuster, and a chain transfer agent) may be used incombination.

In a case where these components are appropriately contained, it ispossible to adjust desired characteristics such as stability and filmproperties of a near-infrared absorption filter. Regarding thesecomponents, for example, the description in paragraphs 0183 to 0228 ofJP2012-003225A ([0237] to [0309] of US2013/0034812A correspondingthereto), paragraphs 0101 to 0104 and 0107 to 0109 of JP2008-250074A,paragraphs 0159 to 0184 of JP2013-195480A, and the like can be referredto, and the contents thereof are incorporated into this specification.

<Preparation and Use of Composition>

The near-infrared absorption composition according to the invention canbe prepared by mixing the above-described components.

In the preparation of the composition, the components constituting thecomposition may be collectively formulated, or sequentially formulatedafter being dissolved or dispersed in an organic solvent. An input orderor a work condition during the formulation is not particularly limited.

According to the invention, for the purpose of removing foreignsubstances, reducing defects, or the like, the composition is preferablyfiltrated with a filter. The filter can be used without limitation, aslong as it has been used for the filtration use. Examples thereofinclude filters made of a fluorine resin such as polytetrafluoroethylene(PTFE), a polyamide resin such as nylon-6 or nylon-6,6, or a polyolefinresin (with high density and ultrahigh molecular weight) such aspolyethylene or polypropylene (PP). Among these materials, polypropylene(including high-density polypropylene) and nylon are preferable.

The hole diameter of the filter is preferably 0.1 to 7.0 μm, morepreferably 0.2 to 2.5 μm, even more preferably about 0.2 to 1.5 μm, andstill more preferably 0.3 to 0.7 μm. In a case where the hole diameteris within this range, it is possible to securely remove fine foreignsubstances such as impurities or aggregates included in the composition,while the filter clogging is suppressed.

When the filter is used, a different filter may be combined therewith.In this case, the filtering in a first filter may be performed once, ortwice or more times. In a case where the filtering is performed twice ormore times by combining a different filter, the hole diameters of asecond filter or thereafter are preferably equal to or greater than ahole diameter of a first filter. In addition, a first filter having adifferent hole diameter within the above-described range may becombined. Regarding the hole diameters herein, nominal values of filtermanufacturers can be referred to. A commercially available filter can beselected from various filters provided by, for example, Nihon Pall Ltd.,Toyo Roshi Kaisha, Ltd., Entegris Japan Co., Ltd. (formerly, MykrolisCorporation), or Kitz Microfilter Corporation.

As a second filter, a filter formed with the same material as theabove-described first filter can be used. The hole diameter of thesecond filter is preferably 0.2 to 10.0 μm, more preferably 0.2 to 7.0μm, and even more preferably 0.3 to 6.0 μm. In a case where the holediameter is within this range, foreign substances can be removed whilecomponent particles contained in the composition remain.

The viscosity of the near-infrared absorption composition according tothe invention is preferably in the range of 1 to 3,000 mPa·s in a casewhere, for example, the near-infrared absorption filter is formed bycoating. The lower limit thereof is more preferably not less than 10mPa·s, and even more preferably not less than 100 mPa·s. The upper limitthereof is more preferably not greater than 2,000 mPa·s, and even morepreferably not greater than 1,500 mPa·s.

The near-infrared absorption composition according to the invention canalso be used in a near-infrared absorption filter (for example, anear-infrared absorption filter for a wafer level lens) on a lightreceiving side of a solid-state imaging device, a near-infraredabsorption filter on a back surface side (a side opposite to a lightreceiving side) of a solid-state imaging device, and the like. Inaddition, the near-infrared absorption composition according to theinvention may be directly applied to an image sensor to form a coatingfilm.

Since the near-infrared absorption composition according to theinvention can be supplied in a coatable state, a near-infraredabsorption filter can be easily formed on a desired member or a desiredposition in a solid-state imaging device.

The near-infrared absorption composition according to the invention canbe used in, for example, (i) a near-infrared absorption filter which canabsorb light in a specific near-infrared region, (ii) a near-infraredabsorption filter which can absorb light in a near-infrared region witha wider wavelength region than in a case of light absorbed only by thecompound represented by Formula (1), and the like.

In a case where the near-infrared absorption composition is used in the(i) near-infrared absorption filter described above, it is preferablethat the near-infrared absorption composition according to the inventioncontains the compound represented by Formula (1) and does substantiallynot contain a near-infrared absorption substance having a maximumabsorption wavelength in a near-infrared region different from themaximum absorption wavelength of the compound represented by Formula(1). Here, the expression, substantially not contain means that thecontent of the substance is 1 mass % or less of the compound representedby Formula (1).

In a case where the near-infrared absorption composition is used in the(ii) near-infrared absorption filter described above, it is preferablethat the near-infrared absorption composition according to the inventioncontains a near-infrared absorption substance having a maximumabsorption wavelength in a near-infrared region different from themaximum absorption wavelength of the compound represented by Formula(1), in addition to the compound represented by Formula (1).

<Cured Film and Near-Infrared Absorption Filter>

A cured film and a near-infrared absorption filter according to theinvention use the above-described near-infrared absorption compositionaccording to the invention.

Regarding the near-infrared absorption filter according to theinvention, light transmittance preferably satisfies at least one of thefollowing Condition (1), Condition (2), Condition (3), or Condition (4),and more preferably satisfies all of Conditions (1) to (4).

(1) The light transmittance at a wavelength of 400 nm is preferably notless than 70%, more preferably not less than 80%, even more preferablynot less than 85%, and particularly preferably not less than 90%.

(2) The light transmittance at a wavelength of 500 nm is preferably notless than 70%, more preferably not less than 80%, even more preferablynot less than 90%, and particularly preferably not less than 95%.

(3) The light transmittance at a wavelength of 600 nm is preferably notless than 70%, more preferably not less than 80%, even more preferablynot less than 90%, and particularly preferably not less than 95%.

(4) The light transmittance at a wavelength of 650 nm is preferably notless than 70%, more preferably not less than 80%, even more preferablynot less than 90%, and particularly preferably not less than 95%.

The film thickness of the near-infrared absorption filter according tothe invention can be appropriately selected according to the purpose.The film thickness is preferably not greater than 20 μm, more preferablynot greater than 10 μm, and even more preferably not greater than 5 μm.The lower limit of the film thickness is preferably not less than 0.1μm, more preferably not less than 0.2 μm, and even more preferably notless than 0.3 μm.

Regarding the near-infrared absorption filter according to theinvention, light transmittance in a total wavelength range of 500 to 600nm (preferably 400 to 650 nm) is preferably not less than 70%, morepreferably not less than 80%, and even more preferably not less than 90%in a film thickness of 20 μm or less.

In addition, light transmittance at at least one point in a wavelengthrange of 750 to 830 nm is preferably not greater than 25%, and morepreferably not greater than 10%. For example, light transmittance at awavelength of 785 nm is preferably not greater than 25%, and morepreferably not greater than 10%.

The near-infrared absorption filter according to the inventionpreferably has a maximum absorption wavelength in a wavelength range of750 to 830 nm. In addition, a half-width of the maximum absorptionwavelength is preferably not greater than 130 nm, more preferably notgreater than 100 nm, and even more preferably not greater than 60 nm.The lower limit thereof is, for example, preferably not less than 20 nm.A value obtained by dividing an absorbance at a wavelength of 555 nm byan absorbance at the maximum absorption wavelength is preferably notgreater than 0.10, and more preferably not greater than 0.05. Accordingto this aspect, it is possible to obtain a near-infrared absorptionfilter having excellent visible transparency and high near-infraredshieldability.

<Use of Near-Infrared Absorption Filter>

The near-infrared absorption filter according to the invention is usedfor lenses (camera lenses for digital cameras, cellular phones,vehicle-mounted cameras, and the like, and optical lenses such as f-θlenses and pickup lenses) having a function of absorbing or cutting nearinfrared rays, optical filters for a semiconductor light-receivingelement, near-infrared absorbing films and near-infrared absorbingplates which shield heat rays for energy saving, agricultural coatingagents for the purpose of selective use of sunlight, recording mediumswhich use near-infrared absorption heat, near-infrared absorptionfilters for electronic devices or photos, protection glasses,sunglasses, heat ray shielding films, optical characterreading/recording, prevention of copying of confidential documents,electrophotographic photoreceptors, laser welding, and the like. Thenear-infrared absorption filter is also useful as a noise cut filter fora CCD camera and a filter for a CMOS image sensor.

<Method of Manufacturing Cured Film and Near-Infrared Absorption Filter>

The cured film and the near-infrared absorption filter according to theinvention are obtained using the near-infrared absorption compositionaccording to the invention. Specifically, these can be manufacturedthrough a step of forming a film by applying the near-infraredabsorption composition according to the invention to a support and astep of drying the film. The film thickness, lamination structure, andthe like can be appropriately selected according to the purpose. Inaddition, a step of forming a pattern may be further performed.

The step of forming a film can be performed by applying thenear-infrared absorption composition according to the invention to asupport using a dropwise addition method (drop cast), a spin coater, aslit spin coater, a slit coater, screen printing, applicator coating, orthe like. In a case of a dropwise addition method (drop cast), it ispreferable to form a dropwise addition area of a composition having aphotoresist as a partition wall on the support such that a uniform filmcan be obtained in a predetermined film thickness.

The support may be a transparent substrate consisting of glass or thelike. The support may be a solid-state imaging device or anothersubstrate provided on a light receiving side of the solid-state imagingdevice. In addition, the support may be a layer such as a planarizinglayer provided on the light receiving side of the solid-state imagingdevice.

In the step of drying the film, the drying conditions vary depending onthe respective components, type of the solvent, use ratio, and the like.For example, the drying is performed at a temperature of 60° C. to 150°C. for about 30 seconds to 15 minutes.

Examples of the step of forming a pattern include a method including astep of forming a film-shaped composition layer by applying thenear-infrared absorption composition according to the invention to asupport, a step of exposing the composition layer in a pattern shape,and a step of forming a pattern by developing and removing unexposedportions. As the step of forming a pattern, photolithography or a dryetching method may be used for forming a pattern.

The method of manufacturing a near-infrared absorption filter mayinclude other steps. The other steps are not particularly limited, andcan be appropriately selected according to the purpose. Examples thereofinclude a step of treating a surface of a substrate, a pre-heating step(pre-baking step), a curing treatment step, and a post-heating step(post-baking step).

<<Pre-Heating Step and Post-Heating Step>>

The heating temperature in the pre-heating step and the post-heatingstep is preferably 80° C. to 200° C. The upper limit thereof is morepreferably not higher than 150° C. The lower limit thereof is morepreferably not lower than 90° C.

The heating time in the pre-heating step and the post-heating step ispreferably 30 to 240 seconds. The upper limit thereof is more preferablynot longer than 180 seconds. The lower limit thereof is more preferablynot shorter than 60 seconds.

<<Curing Treatment Step>>

The curing treatment step is a step of performing a curing treatment onthe formed film if necessary. In a case where this treatment isperformed, the mechanical strength of the near-infrared absorptionfilter is improved.

The curing treatment step is not particularly limited, and can beappropriately selected according to the purpose. Preferable examplesthereof include an entire surface exposure treatment and an entiresurface heating treatment. In the invention, the expression “exposure”includes not only irradiation of light having various wavelengths, butalso irradiation of radiation such as electron rays and X-rays.

The exposure is preferably performed by radiation irradiation, and asthe radiation which can be used in the exposure, particularly, electronrays, KrF, ArF, ultraviolet rays such as g-rays, h-rays, and i-rays, andvisible light are preferably used.

Examples of the exposure method include stepper exposure and exposureusing a high-pressure mercury lamp.

The exposure amount is preferably 5 to 3,000 mJ/cm2. The upper limitthereof is more preferably not greater than 2,000 mJ/cm2, and even morepreferably not greater than 1,000 mJ/cm2. The lower limit thereof ismore preferably not less than 10 mJ/cm2, and even more preferably notless than 50 mJ/cm2.

Examples of the entire surface exposure treatment include a method ofexposing an entire surface of the formed film. In a case where thenear-infrared absorption composition according to the invention containsa polymerizable compound, the entire surface exposure promotes thecuring of polymerization components in the film, and thus the curing ofthe film further proceeds, and mechanical strength and durability areimproved.

The device which performs the entire surface exposure is notparticularly limited, and can be appropriately selected according to thepurpose. Preferable examples thereof include an ultraviolet (UV)exposure machine such as an ultrahigh-pressure mercury lamp.

Examples of the method for the entire surface heating treatment includea method of heating the entire surface of the formed film. Through theentire surface heating, the film hardness of the pattern can beincreased.

The heating temperature in the entire surface heating is preferably 100°C. to 260° C. The lower limit thereof is more preferably not lower than120° C., and even more preferably not lower than 160° C. The upper limitthereof is more preferably not higher than 240° C., and even morepreferably not higher than 220° C. In a case where the heatingtemperature is within the above-described range, a film having excellenthardness is easily obtained.

In the entire surface heating, the heating time is preferably 1 to 180minutes. The lower limit thereof is more preferably not shorter than 3minutes, and even more preferably not shorter than 5 minutes. The upperlimit thereof is more preferably not longer than 120 minutes.

The device which performs the entire surface heating is not particularlylimited, and can be appropriately selected among known devices accordingto the purpose. Examples thereof include a dry oven, a hot plate, and aninfrared heater.

<Solid-State Imaging Device and Infrared Sensor>

A solid-state imaging device according to the invention includes a curedfilm obtained using the near-infrared absorption composition accordingto the invention.

An infrared sensor according to the invention includes a cured filmobtained using the near-infrared absorption composition according to theinvention.

Hereinafter, an embodiment of the infrared sensor according to theinvention will be described using FIG. 1.

In an infrared sensor 100 illustrated in FIG. 1, a reference numeral 110represents a solid-state imaging device.

An imaging area provided on the solid-state imaging device 110 has anear-infrared absorption filter 111 and a color filter 112. Thenear-infrared absorption filter 111 can be formed using, for example,the near-infrared absorption composition according to the invention.

Areas 114 are provided between infrared transmission filters 113 and thesolid-state imaging device 110. Resin layers (for example, transparentresin layers) which can transmit light of a wavelength transmitting theinfrared transmission filters 113 are disposed on the areas 114. In theembodiment illustrated in FIG. 1, the resin layers are disposed on theareas 114, but the infrared transmission filters 113 may be formed onthe areas 114. That is, the infrared transmission filters 113 may beformed on the solid-state imaging device 110.

Microlenses 115 are disposed on an incidence ray (hν) side of the colorfilters 112 and the infrared transmission filters 113. A planarizinglayer 116 is formed so as to cover the microlenses 115.

According to the embodiment illustrated in FIG. 1, the film thicknessesof the color filters 112 and the film thicknesses of the infraredtransmission filters 113 are the same, but the film thicknesses may bedifferent from each other.

According to the embodiment illustrated in FIG. 1, the color filters 112are provided closer to the incidence ray (hν) side than thenear-infrared absorption filters 111, but the near-infrared absorptionfilters 111 may be provided closer to the incidence ray (hν) side thanthe color filters 112 by changing the order of the near-infraredabsorption filters 111 and the color filters 112.

According to the embodiment illustrated in FIG. 1, the near-infraredabsorption filters 111 and the color filters 112 are laminated to beadjacent to each other, but both of the filters do not have to beadjacent to each other and other layers may be interposed therebetween.

<<Near-Infrared Absorption Filter 111>>

Characteristics of the near-infrared absorption filter 111 are selectedaccording to an emission wavelength of an infrared light emitting diode(infrared LED) to be described later. For example, the near-infraredabsorption filter 111 can be formed using the above-describednear-infrared absorption composition according to the invention.

<<Color Filter 112>>

The color filter 112 is not particularly limited, and color filters forpixel formation which have been known can be used. For example, thedescription in paragraphs 0214 to 0263 of JP2014-043556A can be referredto, and the contents thereof are incorporated into this specification.

<<Infrared Transmission Filter 113>>

Characteristics of the infrared transmission filter 113 are selectedaccording to an emission wavelength of an infrared LED to be describedlater. For example, the following description will be given on theassumption that an emission wavelength of an infrared LED is 830 nm.

Regarding the infrared transmission filter 113, a maximum value of thelight transmittance in a thickness direction of the film in a wavelengthrange of 400 to 650 nm is preferably not greater than 30%, morepreferably not greater than 20%, even more preferably not greater than10%, and particularly preferably not greater than 0.1%. Thetransmittance preferably satisfies the above-described condition in theentire wavelength range of 400 to 650 nm. A maximum value in thewavelength range of 400 to 650 nm is generally not less than 0.1%.

Regarding the infrared transmission filter 113, a minimum value of thelight transmittance in a thickness direction of the film in a wavelengthrange of 800 nm or greater (preferably 800 to 1,300 nm) is preferablynot less than 70%, more preferably not less than 80%, even morepreferably not less than 90%, and particularly preferably not less than99.9%. The transmittance preferably satisfies the above-describedcondition at a portion of the wavelength range of 800 nm or greater, andpreferably satisfies the above-described condition at a wavelengthcorresponding to the emission wavelength of an infrared LED to bedescribed later. The minimum value of the light transmittance in awavelength range of 900 to 1,300 nm is generally not greater than 99.9%.

The film thickness is preferably not greater than 100 μm, morepreferably not greater than 15 μm, even more preferably not greater than5 μm, and particularly preferably not greater than 1 μm. The lower limitthereof is preferably 0.1 μm. In a case where the film thickness iswithin the above-described range, it is possible to obtain a filmsatisfying the above-described spectral characteristics.

The methods of measuring the spectral characteristics and the filmthickness of the film are as follows.

The film thickness measurement is performed on a substrate after dryingwhich has a film using a stylus type surface profile measuring device(DEKTAK150 manufactured by ULVAC Technologies, Inc.).

Regarding the spectral characteristics of the film, the transmittance ismeasured in a wavelength range of 300 to 1,300 nm using anultraviolet-visible-near-infrared spectrophotometer (U-4100 manufacturedby Hitachi High-Technologies Corporation).

The above-described light transmittance condition may be achievedthrough any means. However, for example, the above-described lighttransmittance condition can be preferably achieved by allowing thecomposition to contain a colorant and adjusting the type and the contentof the colorant. Examples of the colorant include compounds having amaximum absorption wavelength in a wavelength range of 400 to 700 nm.The colorant may be a pigment or a dye. As the colorant, for example,colorants described in paragraphs 0019 to 0028 of JP2013-064998A may beused, and the contents thereof are incorporated into this specification.

The infrared transmission filter 113 can be produced using, for example,a composition (infrared transmitting composition) containing two or morecolorants selected from a red colorant, a yellow colorant, a bluecolorant, and a purple colorant.

The content of the pigment in the colorant is preferably 95 to 100 mass% with respect to the total amount of the colorant. The lower limitthereof is more preferably not less than 97 mass %, and even morepreferably not less than 99 mass %.

As an aspect of the colorant, two or more colorants selected from a redcolorant, a yellow colorant, a blue colorant, and a purple colorant arepreferably contained, and a red colorant, a yellow colorant, a bluecolorant, and a purple colorant are more preferably contained. Aspreferable specific examples thereof, Color Index (C.I.) Pigment Red254, C.I. Pigment Yellow 139, C.I. Pigment Blue 15:6, and C.I. PigmentViolet 23 are preferably contained.

In a case where the colorant contained in the infrared transmittingcomposition is obtained by combining a red colorant, a yellow colorant,a blue colorant, and a purple colorant, it is preferable that a massratio of the red colorant is 0.2 to 0.5, a mass ratio of the yellowcolorant is 0.1 to 0.2, a mass ratio of the blue colorant is 0.25 to0.55, and a mass ratio of the purple colorant is 0.05 to 0.15 withrespect to the total amount of the colorants. It is more preferable thata mass ratio of the red colorant is 0.3 to 0.4, a mass ratio of theyellow colorant is 0.1 to 0.2, a mass ratio of the blue colorant is 0.3to 0.4, and a mass ratio of the purple colorant is 0.05 to 0.15 withrespect to the total amount of the colorants.

Next, an image pickup device will be described as an example in whichthe infrared sensor according to the invention is applied. As theinfrared sensor, a motion sensor, a proximity sensor, a gesture sensor,and the like exist.

FIG. 2 is a functional block diagram of an image pickup device. Theimage pickup device includes a lens optical system 1, a solid-stateimaging device 10, a signal processing unit 20, a signal switching unit30, a controller 40, a signal accumulating unit 50, a light emittingcontroller 60, an infrared LED 70 of a light emitting element whichemits infrared light, and image output units 80 and 81. As thesolid-state imaging device 10, the above-described infrared sensor 100can be used. All or a portion of the configurations except for those ofthe solid-state imaging device 10 and the lens optical system 1 can beformed on the same semiconductor substrate. Regarding the respectiveconfigurations of the image pickup device, paragraphs 0032 to 0036 ofJP2011-233983A can be referred to, and the contents thereof areincorporated into this specification.

A camera module having a solid-state imaging device and theabove-described near-infrared absorption filter can be incorporated intothe image pickup device.

EXAMPLES

Hereinafter, the invention will be described in further detail withreference to examples. Materials, amounts, ratios, process details,process orders, and the like provided in the following examples can beappropriately changed without departing from the gist of the invention.Accordingly, ranges of the invention are not limited to the followingspecific examples. Unless otherwise noted, “%” and “parts” are based onthe mass.

<Measurement of Weight Average Molecular Weight (Mw)>

The weight average molecular weight was measured through the followingmethod.

Column Type: TSKgel Super HZ4000 (manufactured by TOSOH Corporation, 4.6mm (internal diameter)×15 cm)

Developing Solvent: Tetrahydrofuran

Column Temperature: 40° C.

Flow Rate (sample amount injected): 60 μL

Device Name: High-Speed GPC (HLC-8220GPC) manufactured by TOSOHCorporation

Calibration Curve Base Resin: Polystyrene

Synthesis of Compound Synthesis of Compound A-1

Compound A-1 was synthesized with reference to Chem. Eur. J. 2009, 15,4857.

8.0 parts by mass of N-methyl-1,2-phenylenediamine and 9.7 parts by massof methyl cyanoacetate were put into a flask and agitated for 5 hoursunder refluxing by heating in a nitrogen atmosphere. After the reaction,the obtained mixture was cooled to the room temperature. Theprecipitated crystal was separated by filtering and subjected topurification by silica column chromatography (hexane/ethyl acetatesolvent). 3.3 parts by mass of Intermediate a-1 was obtained.

25 parts by mass of isoeicosanol (FINE OXOCOL 2000, manufactured byNissan Chemical Industries, Ltd.) and 10.2 parts by mass oftrimethylamine were agitated in 90 parts by mass of toluene, and 10.6parts by mass of methanesulfonyl chloride was added dropwise thereto at−10° C. After the termination of the dropwise addition, the obtainedmixture was reacted for 2 hours at 30° C. An organic layer was taken outby a liquid separation operation and the solvent was distilled off underreduced pressure.

After the solvent was distilled off, 10.5 parts by mass of4-cyanophenol, 13.9 parts by mass of potassium carbonate, and 130 partsby mass of dimethylacetamide were added and reacted for 24 hours at 100°C. An organic layer was taken out by a liquid separation operation andwashed with an aqueous sodium hydroxide solution. Then, the solvent wasdistilled off under reduced pressure to obtain 30 parts by mass ofCompound A which was a slightly yellow liquid.

30 parts by mass of Compound A, 9 parts by mass of diisopropylsuccinate, 40 parts by mass of t-amyl alcohol, and 16.5 parts by mass ofpotassium t-butoxide were put into a flask and agitated for 3 hours at120° C. After the reaction, 100 parts by mass of methanol and 100 partsby mass of water were added, and a precipitate was separated byfiltering. The precipitate was dried by air blowing at 50° C. to obtain19.2 parts by mass of Compound B.

4.3 parts by mass of Compound B and 2.0 parts by mass of Intermediatea-1 were agitated in 250 parts by mass of toluene. Next, 4.5 parts bymass of phosphorus oxychloride was added thereto and agitated for 3hours at 130° C. After the reaction, the obtained mixture was cooled tothe room temperature, and 10 parts by mass of methanol was added theretoand agitated for 5 minutes. To the reaction liquid, an aqueous sodiumcarbonate solution was added and an organic layer was extracted withchloroform. The solvent was removed under reduced pressure and 3.0 partsby mass of Compound C was obtained.

In 30 parts by mass of toluene containing 5.1 parts by mass of2-aminoethyl diphenylborinate, 7.2 parts by mass of titanium chloridewas added and agitated for 30 minutes at 35° C. Next, 3 parts by mass ofCompound C was added thereto and agitated for 2 hours under refluxing byheating. The obtained mixture was cooled to the room temperature, and100 parts by mass of methanol was added thereto and agitated for 30minutes. The precipitated crystal was separated by filtering andsubjected to purification by silica column chromatography(hexane/chloroform solvent). 2.0 parts by mass of Compound A-1 wasobtained with a yield of 52%.

Synthesis of Compound A-6

Compound A-6 was synthesized in the same manner as in the case ofCompound A-1, except that in the synthesis of Compound A-1, Intermediatea-2 synthesized through the following method was used in place ofIntermediate a-1 used in the synthesis of Compound C.

18.2 parts by mass of 60 mass % of sodium hydroxide and 200 parts bymass of tetrahydrofuran were put into a flask and 60 parts by mass oftert-butyl cyanoacetate was added dropwise thereto in an ice bath. Thesewere agitated for 1 hour at room temperature, and then 25 parts by massof 2-chlorobenzoxazole was added thereto and agitated for 12 hours. Thereaction liquid was applied to 1,000 parts by mass of water and 100parts by mass of an acetic acid was added. The precipitate was separatedby filtering and washed with hexane. The crystal was dried by airblowing at 50° C., and thus 39 parts by mass of Intermediate A wasobtained.

39 parts by mass of Intermediate A, 50 parts by mass of atrifluoroacetic acid, and 300 parts by mass of chloroform were put intoa flask and agitated for 1 hour at 60° C. After the reaction, an aqueoussodium carbonate solution was added thereto, and an organic layer wastaken out by a liquid separation operation and washed with an aqueoussaturated sodium chloride solution. Then, the solvent was distilled offunder reduced pressure to obtain a slightly yellow solid. The obtainedslightly yellow solid was subjected to purification by silica columnchromatography (hexane/chloroform solvent). 13 parts by mass ofIntermediate a-2 was obtained.

Synthesis of Compound A-11

Compound A-11 was synthesized in the same manner as in the case ofCompound A-6, except that in Compound A-6, the 2-chlorobenzoxazole usedin the synthesis of Intermediate a-2 was changed to2-chloro-4,6-dimethylpyrimidine.

Synthesis of Compound A-12

Compound A-12 was synthesized in the same manner as in the case ofCompound A-11, except that in Compound A-11, the isoeicosanol (FINEOXOCOL 2000, manufactured by Nissan Chemical Industries, Ltd.) used inthe synthesis of Compound A was changed to 1-bromooctane.

Synthesis of Compound A-15

Compound A-15 was synthesized in the same manner as in the case ofCompound A-6, except that in Compound A-6, the 2-chlorobenzoxazole usedin the synthesis of Intermediate a-2 was changed to 2-chloroquinazoline.

<Preparation of Near-Infrared Absorption Composition>

Examples 1 to 5 and Comparative Examples 1 to 3

A near-infrared absorption composition was prepared by mixing accordingto the following composition.

<Composition>

Near-infrared absorption substance (compound shown in Table 1): 3 parts

Resin A (copolymer of benzyl methacrylate and methyl methacrylate(composition ratio 80/20, Mw=15,000)): 3 parts

Cyclohexanone: 94 parts

Propylene glycol monomethyl ether acetate: 100 parts

Surfactant: MEGAFAC F-554 (manufactured by DIC Corporation): 0.01 parts

Example 6

A near-infrared absorption composition was prepared in the same manneras in Example 1, except that Resin A was changed to Resin B(polycaprolactone (Mw=14,000)).

Comparative Example 4

A near-infrared absorption composition was prepared in the same manneras in Comparative Example 1, except that Resin A was changed to Resin B(polycaprolactone (Mw=14,000)).

<Production of Film>

Each composition was applied to a glass substrate (1737 manufactured byCorning Inc.) using a spin coater, and a heating treatment was performedthereon for 120 seconds using a hot plate at 120° C.

<Evaluation of Maximum Absorption Wavelength in Film and Absorbance>>

A maximum absorption wavelength of each film and an absorbance ratio asa value obtained by dividing an absorbance at a wavelength of 555 nm byan absorbance at the maximum absorption wavelength were measured using aspectrophotometer U-4100 (manufactured by Hitachi High-TechnologiesCorporation). The results are shown in the following table.

TABLE 1 Maximum Absorption Absorbance Ratio Compound Resin Wavelength(555 nm/λmax) Example 1 A-1 Resin A 821 nm 0.04 Example 2 A-6 Resin A780 nm 0.03 Example 3 A-11 Resin A 760 nm 0.03 Example 4 A-12 Resin A763 nm 0.10 Example 5 A-15 Resin A 786 nm 0.05 Example 6 A-1 Resin B 822nm 0.05 Comparative A-100 Resin A 860 nm 0.11 Example 1 Comparative D-5Resin A 790 nm 0.14 Example 2 Comparative D-33 Resin A 750 nm 0.19Example 3 Comparative A-100 Resin B 863 nm 0.11 Example 4

As shown in the table, the compositions of the examples had a maximumabsorption wavelength in a wavelength range of 750 to 830 nm, and thevalue obtained by dividing an absorbance at a wavelength of 555 nm by anabsorbance at the maximum absorption wavelength was 0.10 or less.

On the other hand, Comparative Examples 1 and 4 did not have a maximumabsorption wavelength in a wavelength range of 750 to 830 nm. The valueobtained by dividing an absorbance at a wavelength of 555 nm by anabsorbance at the maximum absorption wavelength was greater than 0.10.

Comparative Examples 2 and 3 had a maximum absorption wavelength in awavelength range of 750 to 830 nm. However, the value obtained bydividing an absorbance at a wavelength of 555 nm by an absorbance at themaximum absorption wavelength was greater than 0.10.

<Solubility of Compound>

The solubility of each compound to propylene glycol monomethyl etheracetate (PGMEA) at 25° C. was evaluated based on the followingstandards. The results are shown in the following table.

A: The solubility of the compound to PGMEA at 25° C. is 2 mass % orgreater.

B: The solubility of the compound to PGMEA at 25° C. is 0.5 mass % toless than 2 mass %.

C: The solubility of the compound to PGMEA at 25° C. is less than 0.5mass %.

TABLE 2 Compound Solubility A-1 A A-6 A A-11 A A-12 B A-15 A A-100 C

As shown in the table, Compounds A-1, A-6, A-11, A-12, and A-15 used inthe examples had excellent solubility.

Compounds in table: The following structures

<Preparation 2 of Near-Infrared Absorption Composition>

A near-infrared absorption composition was prepared by mixing accordingto the following composition. The solid content of the composition was31 mass %, and the content of the near-infrared absorption substancewith respect to the total solid content of the composition was 7.5 mass%.

<Composition>

Near-infrared absorption substance (compound shown in Table 3): 2.3parts

Resin 1 (the following structure): 12.9 parts

Polymerizable compound: Dipentaerythritol hexaacrylate (manufactured byNippon Kayaku Co., Ltd., product name KAYARAD DPHA): 12.9 parts

Photopolymerization initiator: IRGACURE-OXE01[2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedion],manufactured by BASF SE: 2.5 parts

Ultraviolet absorbing agent: UV503 (DAITO CHEMICAL CO., LTD.): 0.5 parts

Surfactant: The following mixture: 0.04 parts

Polymerization inhibitor: Paramethoxyphenol: 0.006 parts

Cyclohexanone: 49.6 parts

Propylene glycol monomethyl ether acetate: 19.3 parts

Resin 1: The following structure (the ratio in terms of the repeatingunit is a molar ratio), Mw=11,500

The synthesis was performed using the method described in paragraphs0247 to 0249 of JP2012-198408A.

Surfactant: The following mixture (Mw=14,000)

<Production of Cured Film>

Each composition was applied to a glass substrate (1737 manufactured byCorning Inc.) using a spin coater such that a film thickness afterdrying was 1.0 μm, and a heating treatment (pre-baking) was performedthereon for 120 seconds using a hot plate at 100° C.

Next, entire surface exposure was performed at 500 mJ/cm2 using an i-raystepper exposure device FPA-3000i5+(manufactured by Canon Inc.). Next,paddle development was performed for 60 seconds at 23° C. using adeveloping machine (CD-2060, manufactured by FUJIFILM ElectronicsMaterials Co., Ltd.), and a rinsing treatment was performed with purewater. Then, spray drying was performed thereon. Using a hot plate at200° C., a heating treatment (post-baking) was performed for 300 secondsto obtain a cured film.

<<Near-Infrared Shieldability Evaluation>>

The transmittance of each cured film at the maximum absorptionwavelength was measured using a spectrophotometer U-4100 (manufacturedby Hitachi High-Technologies Corporation). The near-infraredshieldability was evaluated based on the following standards. Theresults are shown in the following table.

A: Transmittance at 785 nm≦10%

B: 10%<Transmittance at 785 nm≦25%

C: 25%<Transmittance at 785 nm≦40%

D: 40%<Transmittance at 785 nm

<<Visible Transparency Evaluation>>

The transmittance of each cured film at a wavelength of 500 to 600 nmwas measured using a spectrophotometer U-4100 (manufactured by HitachiHigh-Technologies Corporation). The visible transparency was evaluatedbased on the following standards. The results are shown in the followingtable.

A: 80% 5 Minimum value of transmittance at wavelength of 500 to 600 nm

B: 70%: Minimum value of transmittance at wavelength of 500 to 600nm<80%

C: 60%: Minimum value of transmittance at wavelength of 500 to 600nm<70%

D: Minimum value of transmittance at wavelength of 500 to 600 nm<60%

TABLE 3 Near- Visible Maximum Absorbance Com- Infrared Trans- AbsorptionRatio (555 pound Shieldability parency Wavelength nm/λmax) Example 11A-1 B A 815 nm 0.05 Example 12 A-6 A A 770 nm 0.03 Example 13 A-11 B A760 nm 0.05 Example 14 A-12 B B 762 nm 0.10 Example 15 A-15 A A 770 nm0.06 Comparative A-100 D B 855 nm 0.12 Example 11 Comparative D-5 B C780 nm 0.15 Example 12 Comparative D-33 B D 745 nm 0.18 Example 13

As shown in the table, the examples were excellent in near-infraredshieldability and visible transparency. The examples were also excellentin heat resistance and light resistance.

In contrast, the comparative examples were insufficient in near-infraredshieldability and visible transparency.

EXPLANATION OF REFERENCES

-   -   1: lens optical system    -   10: solid-state imaging device    -   20: signal processing unit    -   30: signal switching unit    -   40: controller    -   50: signal accumulating unit    -   60: light emitting controller    -   70: infrared LED    -   80, 81: image output unit    -   100: infrared sensor    -   110: solid-state imaging device    -   111: near-infrared absorption filter    -   112: color filter    -   113: infrared transmission filter    -   114: area    -   115: microlens    -   116: planarizing layer    -   hν: incidence ray

What is claimed is:
 1. A near-infrared absorption compositioncomprising: a compound represented by Formula (1); and a resin, whereinthe compound has a maximum absorption wavelength in a wavelength rangeof 750 to 830 nm in a film in a case where the film is formed using thenear-infrared absorption composition, and a value obtained by dividingan absorbance at a wavelength of 555 nm by an absorbance at the maximumabsorption wavelength is 0.10 or less,

in the formula, R^(1a) and R^(1b) each independently represent an alkylgroup, an aryl group, or a heteroaryl group, Ar¹ and Ar² eachindependently represent a heteroaryl group, R² and R³ each independentlyrepresent a hydrogen atom or a substituent, and R⁴ to R⁷ eachindependently represent a substituent.
 2. The near-infrared absorptioncomposition according to claim 1, wherein in Formula (1), R⁴ to R⁷ eachindependently represent an aryl group or a heteroaryl group.
 3. Thenear-infrared absorption composition according to claim 1, wherein inFormula (1), Ar¹ and Ar² each independently represent any one ofFormulae (A) to (C):

in Formula (A), —X_(A)— represents —O—, —N(R³⁰)—, or —C(R³¹)(R³²)—, R¹¹to R¹⁴ each independently represent a hydrogen atom or a substituent,R³⁰ represents a hydrogen atom, an alkyl group, or an aryl group, R³¹and R³² each independently represent an alkyl group or an aryl group,and * represents a bonding position to Formula (1), in Formula (B), R¹⁵to R¹⁷ each independently represent a hydrogen atom or a substituent,any two of R¹⁵ to R¹⁷ may be bonded to each other to form a ring, and *represents a bonding position to Formula (1), and in Formula (C),—X_(C)— represents —O— or —N(R³³)—, R¹⁸ to R²³ each independentlyrepresent a hydrogen atom or a substituent, R³³ represents a hydrogenatom, an alkyl group, or an aryl group, and * represents a bondingposition to Formula (1).
 4. The near-infrared absorption compositionaccording to claim 1, wherein in Formula (1), R² and R³ eachindependently represent an electron-withdrawing group.
 5. Thenear-infrared absorption composition according to claim 1, wherein inFormula (1), R² and R³ are cyano groups.
 6. The near-infrared absorptioncomposition according to claim 1, wherein in Formula (1), R^(1a) andR^(1b) each independently represent a branched alkyl group, or an arylgroup or a heteroaryl group having, as a substituent, a group having abranched alkyl structure.
 7. The near-infrared absorption compositionaccording to claim 1, further comprising: an organic solvent.
 8. Thenear-infrared absorption composition according to claim 1, wherein theresin is at least one selected from a (meth)acrylic resin, a polyesterresin, and an epoxy resin.
 9. The near-infrared absorption compositionaccording to claim 1, wherein the resin includes a resin having apolymerizable group.
 10. The near-infrared absorption compositionaccording to claim 1, further comprising: a curable compound.
 11. Acured film which is prepared using the near-infrared absorptioncomposition according to claim
 1. 12. A near-infrared absorption filtercomprising: the cured film according to claim
 11. 13. A solid-stateimaging device comprising: the cured film according to claim
 11. 14. Aninfrared sensor comprising: the cured film according to claim 11.